Thursday, 29 May 2014
Sound Systems Design Portfolio (pg 22)
Planning for practice
I need the following tools and equipment to make a PCB
- Etching tank
- Photo sensitive board
- UV box
- Chemicals
- Soldering Irons
- Drill Press
- Side Cutters
I need the following tools and equipment for my enclosure
- Laser cutter (wood being used we can't saw it)
- Wood
- Plastic
- Glue
All the tools and equipment in the electronics room
- Etching tank
- UV box
- Drill Press
- Profile cutter
- Vacuum former
- Saw
- Side cutters
- Soldering Irons
- 3D printer
Would I be able to make a high quality speaker enclosure with tools and equipment at my disposal? If not what will I do.
I will send the wood to be laser cut so we don't breathe in harmful chemicals that are in the wood
I need the following tools and equipment to make a PCB
- Etching tank
- Photo sensitive board
- UV box
- Chemicals
- Soldering Irons
- Drill Press
- Side Cutters
I need the following tools and equipment for my enclosure
- Laser cutter (wood being used we can't saw it)
- Wood
- Plastic
- Glue
All the tools and equipment in the electronics room
- Etching tank
- UV box
- Drill Press
- Profile cutter
- Vacuum former
- Saw
- Side cutters
- Soldering Irons
- 3D printer
Would I be able to make a high quality speaker enclosure with tools and equipment at my disposal? If not what will I do.
I will send the wood to be laser cut so we don't breathe in harmful chemicals that are in the wood
Sound systems design portfolio (pg20)
Soldering mistakes
1. The wires are sticking out all over the place.
Thread the wire through the hole carefully to avoid the wires from sticking out in all directions
2. The solder isn't on the board (not attached)
Make sure to heat up the board and then solder. This will allow the solder to stick to the PCB.
3. Two solderings are touching.
This could be avoided by soldering carefully and by heating up the area around the individual wires at different times, not at the same time.
4. Wires touching.
This could be avoided by cutting the ends of the wires off until only the solder mountain is left. So as soon as you finish soldering that component onto the PCB be sure to cut the wires off.
5. Wires sticking out under the solder mountain.
To prevent this from happening twist the wires around each other so this doesn't happen.
1. The wires are sticking out all over the place.
Thread the wire through the hole carefully to avoid the wires from sticking out in all directions
2. The solder isn't on the board (not attached)
Make sure to heat up the board and then solder. This will allow the solder to stick to the PCB.
3. Two solderings are touching.
This could be avoided by soldering carefully and by heating up the area around the individual wires at different times, not at the same time.
4. Wires touching.
This could be avoided by cutting the ends of the wires off until only the solder mountain is left. So as soon as you finish soldering that component onto the PCB be sure to cut the wires off.
5. Wires sticking out under the solder mountain.
To prevent this from happening twist the wires around each other so this doesn't happen.
Sound Systems Design Portfolio (pg19)
Spot the mistakes.
1. there's no wires or components connected to pad 3 of the IC. it can be fixed by adding components to it and connecting it to one of the rails.
2. the wire of pad 5 doesn't connect to anything, it can be fixed by connecting it to the positive or negative rail.
3. the negative rail is to thin so the current won't be able to flow well. it can be fixed by making the rail on diptrace thicker.
4. pad 4 doesn't have wire connecting the resistor to the negative rail.
5. there is no pad connected to the end of the negative rail. on diptrace you could just add a pad to the end of the rail.
6. the writing is too big. It can be fixed by making the writing smaller on dip trace.
7. the wire isn't connected all the way to the negative rail which is a problem. before you make your PCB you should just check if everything is connected right.
8.1 the wires are crossing over each other, it can be fixed by separating them and putting pads at the end of the wires.
8.2 the wires aren't in line so the current won't flow, it can be fixed by moving the wire to the side.
9. once again the track doesn't connect to anything, it can be fixed by joining it to the negative rail.
1. there's no wires or components connected to pad 3 of the IC. it can be fixed by adding components to it and connecting it to one of the rails.
2. the wire of pad 5 doesn't connect to anything, it can be fixed by connecting it to the positive or negative rail.
3. the negative rail is to thin so the current won't be able to flow well. it can be fixed by making the rail on diptrace thicker.
4. pad 4 doesn't have wire connecting the resistor to the negative rail.
5. there is no pad connected to the end of the negative rail. on diptrace you could just add a pad to the end of the rail.
6. the writing is too big. It can be fixed by making the writing smaller on dip trace.
7. the wire isn't connected all the way to the negative rail which is a problem. before you make your PCB you should just check if everything is connected right.
8.1 the wires are crossing over each other, it can be fixed by separating them and putting pads at the end of the wires.
8.2 the wires aren't in line so the current won't flow, it can be fixed by moving the wire to the side.
9. once again the track doesn't connect to anything, it can be fixed by joining it to the negative rail.
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